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◆ K4D · Semiconductor Programs · Precision Machining

Precision CNC machining
for wafer fab equipment.

Chamber components, fixtures, and structural parts for semiconductor wafer fab equipment. Five-axis Hermle for complex geometries, glass-scale Datron for tight tolerances, Mitutoyo Mistar 555 CMM verification on critical features. Materials selected for vacuum, plasma, and clean-process compatibility. Past programs include Lam Research and Applied Materials.

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Mitutoyo CMM Verified · Temperature-Controlled · Most Quotes in 1 Business Day · Salem, MA

◆ Semiconductor parts shipped into programs at ITAR-Registered Facility

Lam Research Wafer Fab Equipment

Applied Materials Wafer Fab Equipment

Semi OEMs Tier-1 Equipment Makers

Subfab Programs Fixtures & Components

◆ Semi Capability · 01 / 04

Spec sheet for wafer fab equipment.

Materials, tolerances, and inspection envelope a semiconductor equipment sourcing engineer actually needs to confirm fit. Pin down compatibility in thirty seconds.

DocK4D-SEMI-001 · REV 1

ClassNDA on Request

Part types

Chamber components — vacuum-grade structural parts

Wafer-handling fixtures and end effectors

Gas distribution and manifold components

Subfab fixtures and structural equipment parts

R&D prototypes and tool development parts

Materials (semi-grade)

Stainless — 316L, 304, 17-4 PH

Aluminum — 6061-T6, MIC-6, 2024 (hardcoat anodized on request)

Engineering plastics — Ultem (PEI), PEEK, Delrin

Copper alloys — C110, C932 (thermal applications)

Brass — C360 (machining-friendly)

Delivered tolerance

Tight features · ±0.0005" (±13 µm) (called out · CMM-verified)

Production typical · ±0.001" (±25 µm)

Default · ±0.003" (±75 µm) (unless tighter is specified on the print)

Envelope

39.4 × 27.6 × 9.6 in · 1000 × 700 × 245 mm (Datron M10 Pro)

23.6 × 21.7 × 17.7 in · 600 × 550 × 450 mm (Hermle C250 · 5-axis)

22.0 × 22.0 × 24.6 in · 560 × 560 × 625 mm (Okuma MB-4000H · 4-axis horizontal)

Inspection

Mitutoyo Mistar 555 CMM (Renishaw PH10MQ probe)

Trimos V5 height gauge + Mitutoyo bench suite

First article (FAI) inspection reports on request

Process

Temperature-controlled facility (thermal stability over long cycles)

Programmed in hyperMILL (5-axis), Fusion 360 + SolidWorks (CAD)

Material certifications and traceability on request

Volume

Prototype · First article · Production runs

No minimums — engineering teams and R&D welcome

File formats

STEP · IGES · SolidWorks · PDF

End of spec — submit RFQ for program-specific confirmation K4D · SEMI

◆ Why Semi · 02 / 04

Fab equipment parts demand dimensional stability and surface finish that hold.

A vacuum chamber component that drifts 20 µm out of tolerance over a long machining cycle is scrap. Semi-grade work depends on a stable thermal environment, the right machine for the geometry, and verification on every critical feature.

§ Principle 01 / 01

“Temperature is part of the spec.”

Thermal expansion of stock and tooling is the largest source of dimensional drift on long programs — including the long cycles common in chamber components and fab fixtures. Holding the room at one temperature is the most reliable way to keep the print and the part in agreement, run after run. Critical surfaces and tolerances are verified on the Mitutoyo Mistar 555 CMM before parts leave the floor.

◆ Anchored in Temperature-Controlled · Mitutoyo CMM

◆ Semi FAQ · 03 / 04

Wafer-fab equipment questions.

Material, vacuum-compatibility, and inspection questions semi equipment sourcing and engineering teams ask before issuing an RFQ.

What semiconductor-grade materials do you machine?

316L stainless, 304 stainless, 17-4 PH stainless, 6061-T6 and MIC-6 aluminum (including hardcoat-anodized), Ultem, PEEK, Delrin, copper alloys, and brass. All common materials used in chamber, fixture, and structural fab equipment work.

Can you machine vacuum-grade and chamber-compatible parts?

Yes. Vacuum-compatible 316L SS and 6061 aluminum, with surface finishes machined to spec. Critical surface-finish features verified on the Mitutoyo Mistar 555 CMM. We work to drawing call-outs on finish, dimensional tolerance, and material certifications.

What kinds of fab parts have you made?

Chamber components, fixturing for wafer handling, structural fab equipment parts, and subassemblies. Past programs include Lam Research and Applied Materials work delivered through tier-2 supply chains.

Do you provide first article inspection for fab equipment parts?

Yes. The Mitutoyo Mistar 555 CMM with Renishaw PH10MQ probe verifies critical features and tight tolerances. First-article inspection reports available on request.

Do you support semi-equipment prototype + production volumes?

Yes. From one-off prototypes and engineering iterations to low-rate and mid-volume production. No minimums. R&D and engineering teams welcome.

◆ Semiconductor RFQ · 04 / 04

Send a print.
Quote on semi programs in one business day.

STEP, IGES, SolidWorks, or PDF. Secure intake with NDA available on request. Most quotes return within one business day with price, lead time, and clarifying questions.

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Precision CNC machining for wafer fab equipment.